.asm | Complete Assembly
.drw | 2D Technical Drawing
.frm | Predefined Sheet Format
.mfg | CNC Machining Data
.lay | Parameter Book
.sec | Parametric Sketch
.dgm | Relationship Diagram
.rep | Design Report
.mrk | Mark-up Annotations
.cem | Wiring Diagram
.int | R13 Front End
.g | Granite Interface
.neu | Neutral File
.ol/.ed | Creo View Visualization
Category | Supported Formats | Typical Use Cases |
---|---|---|
Neutral 3D CAD | STEP, IGES, ACIS, Parasolid | Multi-CAD Collaboration |
2D CAD | DWG, DXF | Exchange with Design Offices |
Rapid Prototyping | STL, 3MF | 3D Printing Industrial |
ECAD Data | IDF, IDX | Electronic/Mechanical Integration |
Other Systems | MEDUSA, Rhino, Inventor, VDA | Historical Data Migration |
A flagship solution for complex CAD migrations,Proficiency preserves build history when converting between Creo and other systems (SolidWorks, CATIA, NX):
Natively integrated into Creo, this functionality allows:
This combination of native Creo tools and CAD Interop solutions creates a complete ecosystem for industrial interoperability, covering everything from lightweight visualization needs to complex migrations while preserving design intent.
Creo implements the EDMD IDX protocol for incremental synchronization between electronic (Altium, Cadence) and mechanical environments. This system tracks changes to components and board outlines, while generating files optimized for rapid iterations. The Compare tool in Creo View ECAD provides visual differential analysis of revisions to avoid misinterpretations.
Importing IDF/IDX files into Creo Parametric automatically translates electronic footprint constraints into mechanical design rules. This functionality is essential for compact assemblies where precise thermal and vibration margins must be met.
The interoperability ecosystem offered by Creo, enhanced by CAD Interop solutions, sets a high standard in multi-source CAD data management. Recent advances such as UNITE technology and the EDMD IDX protocol enable seamless integration between mechanical and electronic disciplines.
In the future, the integration of artificial intelligence to automatically predict and resolve interoperability conflicts could further improve these processes. Furthermore, the growing adoption of open source standards such as glTF for virtual reality requires constant adaptation to maintain industrial relevance in this rapidly evolving field.